
Surveillance & Recon

Receive, signal-processing and antenna-control assemblies for low-altitude radar, the next-generation short-range air-defence radar and the counter-battery radar Ⅱ, together with compact, lightweight EO/IR signal processors — circuit-card assemblies designed and produced at every level from system to board.
Low-Altitude Radar
Within the system hierarchy — array antenna and digital-conversion assembly at system level, T/R control assembly at board level — Digitron develops the digital-conversion and transmit/receive control assemblies.
System → Assembly → Board
Digital Conversion Assembly
01- Timing-signal generation design
- HDLC / SPI / UART communication interface design
Transmit/Receive Control Assembly
02- Timing-signal generation, including search-radar transmit timing
- Multi-channel ADC digital-conversion design
- SFPDP interface design for optical signal conversion
- FPDP / SPI / LVDS communication interface design
- Built-in test circuit design for module and unit output signals
Next-Generation Short-Range Air-Defence Radar
Within the hierarchy — receive assembly at system level, multi-channel receive circuit module at board level — Digitron covers multi-channel reception and digital down-conversion.
System → Assembly → Board
Next-Gen Short-Range Air-Defence Radar
Receive Assembly
Multi-Channel Receive Circuit Module
01- Receive-path ADC digital-conversion design
- Optical-conversion IP core design
- Optical-transceiver interface transmission design
- S-FPDP / MSPI / LVDS communication interface design
- Digital down-conversion (DDC) design
- Digital filter design
Counter-Battery Radar Ⅱ
Six circuit-card assemblies spanning the solid-state transmit/receive module, the transmit/receive assembly and the antenna-control assembly.
System → Assembly → Board
Counter-Battery Radar Ⅱ
Solid-State T/R Module
T/R Assembly
Antenna Control Assembly
Multi-Channel Receive Circuit Module
01- Receive-path ADC digital-conversion design
- Optical-conversion IP core design
- Optical-transceiver interface transmission design
- S-FPDP / MSPI / RS-422 communication interface design
- Digital down-conversion (DDC) and digital filter design
Transmit/Receive Unit Control Module
02- Communication interfaces to the six subordinate modules
- FPGA logic design using a hardware description language
- DSP design for high-speed computation and control
Power Control Circuit Card
03- Power and current monitoring and regulation
- Power sequencing
- Per-channel over-current and over-voltage cut-off
- Safe power switching
Beam-Steering Module
04- Microwave and antenna design
- Phase shifter, high-power amplifier and variable-gain amplifier design
- FPGA logic design using a hardware description language
- DSP design for high-speed computation and control
Antenna Control Module
05- Receive-path ADC digital-conversion design
- S-FPDP optical-conversion communication interface design
- HDLC / SPI / LVDS communication interface design
Antenna Calibration Module
06- Digital signal conversion and digital down-conversion (DDC) design
- SPI / RS-232 communication interface design
- DSP design for high-speed phase-information extraction and control
Electro-Optics (EO/IR)
Sensor-control, signal-processing, cable and temperature-sensor assemblies for compact, lightweight EO/IR signal processors.
Compact, Lightweight EO/IR Signal Processor
01- Sensor control board · thermal-dissipation design
- Sensor control board · Camera Link and Aurora high-speed interface design
- Sensor control board · focus and zoom motor drive design
- Sensor control board · I²C / RS-422 / RS-232 / SPI interfaces and FPGA logic design
- Signal-processing assembly · optical video receive interface and video format conversion
- Elevation cable assembly · flexible PCB design
- Temperature-sensor assembly · sensor monitoring interface design











