DIGITRON ㈜디지트론
Business

Surveillance & Recon

Receive, signal-processing and antenna-control assemblies for low-altitude radar, the next-generation short-range air-defence radar and the counter-battery radar Ⅱ, together with compact, lightweight EO/IR signal processors — circuit-card assemblies designed and produced at every level from system to board.

Low-Altitude Radar

Within the system hierarchy — array antenna and digital-conversion assembly at system level, T/R control assembly at board level — Digitron develops the digital-conversion and transmit/receive control assemblies.

System Breakdown

System → Assembly → Board

System
  • Low-Altitude Radar
Assembly

Digital Conversion Assembly

01
  • Timing-signal generation design
  • HDLC / SPI / UART communication interface design

Transmit/Receive Control Assembly

02
  • Timing-signal generation, including search-radar transmit timing
  • Multi-channel ADC digital-conversion design
  • SFPDP interface design for optical signal conversion
  • FPDP / SPI / LVDS communication interface design
  • Built-in test circuit design for module and unit output signals

Next-Generation Short-Range Air-Defence Radar

Within the hierarchy — receive assembly at system level, multi-channel receive circuit module at board level — Digitron covers multi-channel reception and digital down-conversion.

System Breakdown

System → Assembly → Board

System
  • Next-Gen Short-Range Air-Defence Radar
Assembly
  • Receive Assembly

Multi-Channel Receive Circuit Module

01
  • Receive-path ADC digital-conversion design
  • Optical-conversion IP core design
  • Optical-transceiver interface transmission design
  • S-FPDP / MSPI / LVDS communication interface design
  • Digital down-conversion (DDC) design
  • Digital filter design

Counter-Battery Radar Ⅱ

Six circuit-card assemblies spanning the solid-state transmit/receive module, the transmit/receive assembly and the antenna-control assembly.

System Breakdown

System → Assembly → Board

System
  • Counter-Battery Radar Ⅱ
Assembly
  • Solid-State T/R Module
  • T/R Assembly
  • Antenna Control Assembly

Multi-Channel Receive Circuit Module

01
  • Receive-path ADC digital-conversion design
  • Optical-conversion IP core design
  • Optical-transceiver interface transmission design
  • S-FPDP / MSPI / RS-422 communication interface design
  • Digital down-conversion (DDC) and digital filter design

Transmit/Receive Unit Control Module

02
  • Communication interfaces to the six subordinate modules
  • FPGA logic design using a hardware description language
  • DSP design for high-speed computation and control

Power Control Circuit Card

03
  • Power and current monitoring and regulation
  • Power sequencing
  • Per-channel over-current and over-voltage cut-off
  • Safe power switching

Beam-Steering Module

04
  • Microwave and antenna design
  • Phase shifter, high-power amplifier and variable-gain amplifier design
  • FPGA logic design using a hardware description language
  • DSP design for high-speed computation and control

Antenna Control Module

05
  • Receive-path ADC digital-conversion design
  • S-FPDP optical-conversion communication interface design
  • HDLC / SPI / LVDS communication interface design

Antenna Calibration Module

06
  • Digital signal conversion and digital down-conversion (DDC) design
  • SPI / RS-232 communication interface design
  • DSP design for high-speed phase-information extraction and control

Electro-Optics (EO/IR)

Sensor-control, signal-processing, cable and temperature-sensor assemblies for compact, lightweight EO/IR signal processors.

Compact, Lightweight EO/IR Signal Processor

01
  • Sensor control board · thermal-dissipation design
  • Sensor control board · Camera Link and Aurora high-speed interface design
  • Sensor control board · focus and zoom motor drive design
  • Sensor control board · I²C / RS-422 / RS-232 / SPI interfaces and FPGA logic design
  • Signal-processing assembly · optical video receive interface and video format conversion
  • Elevation cable assembly · flexible PCB design
  • Temperature-sensor assembly · sensor monitoring interface design